Home // ADVCOMP 2023, The Seventeenth International Conference on Advanced Engineering Computing and Applications in Sciences // View article
Multifractal Analysis of Thermal Images of Electronic Devices in Different Colour Profiles
Authors:
Marina Díaz-Jiménez
Juan Carlos de la Torre
Javier Jareño-Dorado
Patricia Ruiz
Bernabé Dorronsoro
Pablo Pavón-Domínguez
Keywords: Multifractal analysis; thermal images; colour formats; box-counting; colour images.
Abstract:
Nowadays, there are many methods for analysing images. Among them, multifractal approach is able to characterise images in terms of the complexity of patterns they contain. However, multifractal methods are very sensitive to small changes in colour images. This study presents a preliminary study for the accurate characterisation of electronic devices in terms of heat dissipation using multifractal analysis. Specifically, a novel methodology using multifractal approach is proposed to characterise images in different colour formats: grey-scale, Red-Green-Blue (RGB), Cyan-Magenta-Yellow-Key (CMYK), Hue-Saturation-Value (HSV) and Hue-Saturation-Intensity (HSI), and the results are compared. For this purpose, thermal images of a Pi3 Raspbian Desktop board are analysed with the aim of finding out the results of the multifractal analysis on different areas of the board. Multifractal analysis is carried out through the box-counting method and the method of moments, since they allow to extract the main multifractal parameters, such as, the generalised dimensions function, D(q) and the degree of multifractality, ∆D(q). Results obtained show that both scaling properties and multifractal parameters vary according to the colour format, i.e., the same image, exhibits different multifractal properties depending on the colour format.
Pages: 7 to 13
Copyright: Copyright (c) IARIA, 2023
Publication date: September 25, 2023
Published in: conference
ISSN: 2308-4499
ISBN: 978-1-68558-107-7
Location: Porto, Portugal
Dates: from September 25, 2023 to September 29, 2023