Home // ADVCOMP 2024, The Eighteenth International Conference on Advanced Engineering Computing and Applications in Sciences // View article

FEM Modeling for PCB Assembly Simulation

Authors:
Ming-Hsiao Lee
Jiunn-Horng Lee
Chih-Min Yao
Jen-Gaw Lee

Keywords: PCB; PCBA; Warpage; Trace mapping.

Abstract:
A Printed Circuit Board (PCB) is a multi-layered composite, which consists of several layers of copper circuits and dielectric materials. It is used as a backbone to carry and connect various electronic components, i.e., PCB Assembly (PCBA), to achieve certain functions. Currently, most of the products need PCBAs to fulfill their functions. Nevertheless, because the components, e.g., chips, are decreasing in size, the accuracy and reliability of PCBAs have become critical issues, either in manufacturing processes or in actual uses. One of the serious problems is the warpage of the PCB, which is induced by the thermal mismatch due to unevenly-distributed circuits and multi-materialled components during the manufacturing process, which experiences a large temperature change. This may cause defects and failures in the assemblies, e.g., the chips and PCB are not well connected due to the dislocation. It is helpful to simulate in advance to evaluate possible defects. However, since the circuits on a PCB are very tiny, compared with the size of the PCB or the components, it is unpractical and not feasible to build a finite element model to include all the details of circuits and components, which are attached to the PCB with a big amount of solder joints. To avoid the difficulties, a new effective modeling approach, which adopts equivalent material properties, is proposed for PCBA’s simulation. In this approach, the multi-layered PCB and the attached components are modeled with a moderate mesh, while the circuit’s and solder joint’s effects are still included. With the proposed approach, the analysis model can be useful and efficient for simulating the PCBA to evaluate the manufacturing process and structural characteristics of the PCBA.

Pages: 49 to 51

Copyright: Copyright (c) IARIA, 2024

Publication date: September 29, 2024

Published in: conference

ISSN: 2308-4499

ISBN: 978-1-68558-184-8

Location: Venice, Italy

Dates: from September 29, 2024 to October 3, 2024