Home // ALLSENSORS 2017, The Second International Conference on Advances in Sensors, Actuators, Metering and Sensing // View article

Design and Fabrication of Sensor Chip with Heater for Semiconductor Flip-Chip Package Application

Authors:
Boo Taek Lim
Young-Su Kim
Nam Soo Park
Boung Ju Lee

Keywords: semiconductor; sensor chip; heater; micro-bump; flip-chip package; thermal reliability

Abstract:
A heat generated from semiconductor chips and chip packages is considered a critical issue for high-performance and reliable device operation. In this paper we demonstrate a simple semiconductor chip with both heat generation and temperature sensor functions. By evaluating the relationship between the temperature of the chip and the resistance of the sensor, the thermal properties of the semiconductor package material can be determined. The heat generation block and temperature sensor are made of aluminum lines, not active circuit, so manufacturing cost is low and the processes are simple

Pages: 8 to 9

Copyright: Copyright (c) IARIA, 2017

Publication date: March 19, 2017

Published in: conference

ISSN: 2519-836X

ISBN: 978-1-61208-543-2

Location: Nice, France

Dates: from March 19, 2017 to March 23, 2017