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Simultaneous Measurement of Temperature and Expansion on Radio Frequency Power Electronic Components
Authors:
Eric Joubert
Olivier Latry
Jean-Philippe Roux
Keywords: thermal measurement; laser; electronic components.
Abstract:
This paper presents a new approach for measuring physical variables on micro-electronic components. An optical system is used to simultaneously quantify the surface temperature of a component and its expansion. This double acquisition is achieved by a Michelson interferometer coupled with a Charge Coupled Device (CCD) line device. To validate this method, the temperature measurements were directly compared with the results obtained by an infrared camera and by a measurement of variation of I(V). The displacement measurements were compared with those obtained by a laser 3D vibrometer, whose physical principle is completely different. Consistent results were obtained regarding the different techniques.
Pages: 7 to 10
Copyright: Copyright (c) IARIA, 2014
Publication date: November 16, 2014
Published in: conference
ISSN: 2308-426X
ISBN: 978-1-61208-379-7
Location: Lisbon, Portugal
Dates: from November 16, 2014 to November 20, 2014