Home // ICQNM 2011, The Fifth International Conference on Quantum, Nano and Micro Technologies // View article

Dry Film Resist Microfluidic Channels on Printed Circuit Board and its Application as Fluidic Interconnection for Nanofluidic Chips: Fabrication Challenges

Authors:
Nuria Berenice Palacios Aguilera
Venkata R. S. S. Mokkapati
Jeroen Bastemeijer
Jeff R. Mollinger
Andre Bossche

Keywords: dry film resist; fluidic interconnection; printed circuit board; nanofluidic channels, integration

Abstract:
Nowadays, nanofluidic chips are usually fabricated with silicon and/or glass. A simple and reliable integration packaging method that provides fluidic interconnection to the outside world has not been yet fully developed. The use of PCB material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work.

Pages: 71 to 76

Copyright: Copyright (c) IARIA, 2011

Publication date: August 21, 2011

Published in: conference

ISSN: 2308-3530

ISBN: 978-1-61208-151-9

Location: Nice/Saint Laurent du Var, France

Dates: from August 21, 2011 to August 27, 2011