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Microcondensation sensors for field tests and for simulation of environment in climat chambers

Authors:
Thomas Frank
Michael Hintz
Barbara March
Arndt Steinke

Keywords: condensation, humidity, migration, corrosion

Abstract:
Condensation associated with the risk of electrochemical and chemical migration plays an increasing significance in the field of reliability of electronic components. The trends towards challenging electronic assembly technologies such as minimization of conductive track widths and spacing,and higher density in electric elements are increasingly faced with the negative influences of micro-condensation. The condensation occurs as a result of the thermodynamic conditions in the environment of the electronic board. The condensed water is in equilibrium of condensation and evaporation, not in a static state. Due to this fact, there is a demand for sensors to record the real state permanently. Due to its miniaturized packaging, a new generation of micro-condensation sensors allows placement on different parts of electronic devices. Results of field tests in different automobiles and in climate chambers are presented.

Pages: 1 to 4

Copyright: Copyright (c) IARIA, 2011

Publication date: August 21, 2011

Published in: conference

ISSN: 2308-3514

ISBN: 978-1-61208-145-8

Location: Nice/Saint Laurent du Var, France

Dates: from August 21, 2011 to August 27, 2011