Home // SENSORDEVICES 2022, The Thirteenth International Conference on Sensor Device Technologies and Applications // View article
Authors:
Bilel Achour
Lilian Marty
Kevin Sanchez
Samuel Charlot
Xavier Dollat
Benjamin Reig
Laurent Bouscayrol
Aurélie Lecestre
Anthony Coustou
André Ferrand
Hervé Aubert
Patrick Pons
Keywords: blast waves; pressure sensor; packaging; mechanical stress; Finite Element Method
Abstract:
The packaging is an important step, allowing to transform the transducer chip into a sensor. This step is necessary to perform the sensor characterization in a real environment, while minimizing the impact of the influence parameters on the sensor response. This study concerns the impact of the packaging on the static response of a miniature pressure sensor dedicated to the monitoring of blast waves. The transducer is based on 5 µm - thick rectangular (55 µm x 135 µm) silicon membrane and piezoresistive gauges. Pressure sensitivity measurements are performed using stressed and non-stressed sensor’s holder configurations. Measurements results indicate that the pressure sensitivity is doubled when the sensor’s holder is stressed. Finite Element Method simulations using COMSOL Multiphysics software show here that this result originates from the deformation of the sensor’s holder, which leads to the deflection of the thin silicon membrane.
Pages: 15 to 20
Copyright: Copyright (c) The Government of CNRS, 2022. Used by permission to IARIA.
Publication date: October 16, 2022
Published in: conference
ISSN: 2308-3514
ISBN: 978-1-68558-006-3
Location: Lisbon, Portugal
Dates: from October 16, 2022 to October 20, 2022