Home // International Journal On Advances in Systems and Measurements, volume 5, numbers 1 and 2, 2012 // View article
Authors:
Nuria B. Palacios Aguilera
Venkata R. S. S. Mokkapati
Hendrikus A. Visser
Jeroen Bastemeijer
Jeff R. Mollinger
Remko Akkerman
Andre Bossche
Keywords: dry film resist, printed circuit board, inkjet printing, integration, low-cost
Abstract:
Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work.
Pages: 11 to 21
Copyright: Copyright (c) to authors, 2012. Used with permission.
Publication date: June 30, 2012
Published in: journal
ISSN: 1942-261x